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FOR IMMEDIATE RELEASE
XILINX ISSUES PRODUCT ADVISORY
SAN JOSE, CA, JANUARY 13, 2004 -- Xilinx, Inc. (Nasdaq: XLNX)
has issued a product advisory potentially affecting certain lots of
its Virtex-II Pro and XC2V6000 products using flip chip technology.
The affected parts were manufactured using improper solder material
that may cause random upset of device configuration. This issue is
isolated to a limited number of parts assembled in calendar 2003,
using a packaging substrate from only one of our substrate vendors.
The issue has subsequently been resolved and shipments with proper
solder have resumed. Xilinx is currently identifying and notifying
all customers and is working on an individual basis with customers
to address their particular situation. There will be no material
impact on the December quarter 2003 or March quarter 2004 financial
results.
This release contains forward-looking statements and projections.
Actual events and results may differ materially from those in the
forward-looking statements and are subject to risks and
uncertainties including our ability to deliver replacement product
to customers in a timely manner, reliance upon third party
suppliers, Xilinx's ability to accurately identify all affected
products in inventory, and other risk factors listed in our most
recent Form 10K.
About Xilinx
Xilinx is the worldwide leader in complete programmable logic
solutions. For more information, visit www.xilinx.com.
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