XILINX MEDIA AND EVENT ALERT
January 30, 2004

Xilinx to Participate at DesignCon 2004

Xilinx today announced its involvement in DesignCon 2004. The DesignCon conference program provides updates on the latest technology news and advances affecting design engineers working at the chip, board, and system levels. Participation by Xilinx includes:

• Xilinx and Winchester Electronics In-Booth Demonstration - Booth #225
  Xilinx and Winchester Electronics demonstrate the world's first implementation of a fully functioning 10 Gbps backplane reference design, manufactured using Winchester's SIP1000 I-Platform™ Passive Interconnect Technology with Xilinx® Virtex-II Pro™ X FPGAs, and tested using Agilent 10 Gbps test and measurement equipment. Consistent with the I/O technology detailed in the UXPi standard, the two companies demonstrated that 10 Gbps backplanes can be manufactured with off-the-shelf products available today from Winchester Electronics and Xilinx.
• White Paper Presentations
  Xilinx and its partners will also be presenting a number of white papers at the conference including:
  • A High Channel-Density, Ultra-High Bandwidth Reference Backplane Designed and Manufactured for 10-Gbps NRZ Serial Signaling - presented by Winchester Electronics and Xilinx: Tuesday, February 3, 10:00 - 10:45 a.m.
  • A Reference Design for an FPGA-Based 64-Bit/133MHz PCI-X Interface - presented by Avnet Design Services, Jungo and Xilinx: Tuesday, February 3, 10:00 am - 10:20 a.m.
  • A Reference Design for a 3.125-Gigabit Serial Channel Using an FPGA - presented by Avnet Design Services and Xilinx: Tuesday, February 3, 11:00 - 11:20 a.m.
  • Method for Optimizing a 10-Gbps PCB Signal Launch - presented by Ansoft, Eval Solutions and Xilinx: Wednesday, February 4, 8:30 - 9:15 a.m.
  • Crosstalk in 10-Gbps Serial Channels: Optimizing the Forgotten Component - presented by Winchester Electronics: Wednesday, February 4, 9:30 - 10:15 a.m.
  • A Reference Design for an FPGA-Based 10 Gigabit Ethernet Port - presented by Avnet Design Services, Infineon and Xilinx: Tuesday, February 3, 10:25 - 10:45 a.m.
  • A Reference Design for High-Speed Backplane Designs presented by Avnet Design Services and Xilinx: Wednesday, February 4, 9:55 - 10:15 a.m.
  • FPGA Implementation of an OFDM Physical Layer - presented by Dr. Chris Dick, Chief DSP Architect at Xilinx: Conference Session SW2: Tuesday, November 18, 1:30 - 3:00 p.m.

Xilinx will also be represented in the FPGA versus ASIC Design Panel. Join Steve Douglass of Xilinx and other panel participants for a lively discussion on FPGA vs. ASIC design. Industry leaders in both FPGA and ASIC will debate the pros and cons of FPGAs versus ASICs, the structured ASIC option, as well as how all three are shaping the future of EDA.

FPGA vs. ASIC Design Panel - Xilinx represented by Steve Douglass, senior director of APD FPGA Product Development at Xilinx: Wednesday, February 4, 9:15- 10:30 a.m.

Registration
For more information or to register online, visit http://www.designcon.com/index.html.

About Xilinx
Xilinx, Inc. (NASDAQ: XLNX) is the worldwide leader of programmable logic solutions. Additional information about Xilinx is available at www.xilinx.com.

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